Inventor · disambiguated record
Joon Dong Kim
Also filed as: KIM JOON-DONG
13 granted patents·8 pending applications·58 citations·filing 2008–2025
89Inventor score
Files withAMKOR TECHNOLOGY INC6AMKOR TECH SINGAPORE HOLDING PTE LTD5HAN CHANG-SOO2KIM JOON-DONG2INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
21 records- 0195US10134687B1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·24 cites·20 claims
- 0290US10381313B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·6 cites·20 claims
- 0390US10037949B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 31, 2018·11 cites·20 claims
- 0487US9741701B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·4 cites·20 claims
- 0586US11094645B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 0682US10290621B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 0780US12255197B2Package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 0879US2025158007A1Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0973US11508712B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1065US8791394B2Heating substrate equipped with conductive thin film and electrode, and manufacturing method of the sameHAN CHANG-SOO·Filed 2008·Granted Jul 29, 2014·6 cites·16 claims
- 1163US10867984B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·0 cites·6 claims
- 1256US2025087546A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 1353US2009250102A1Photoelectric conversion device using semiconductor nanomaterials and method of manufacturing the sameKOREA MACH & MATERIALS INST·Filed 2008·Application pending·0 cites
- 1452US8388127B2Vision assistance device having conductive transparent thin filmHAN CHANG-SOO·Filed 2009·Granted Mar 5, 2013·1 cites·16 claims
- 1552US2012132266A1Photoelectric conversion device using semiconductor nanomaterialKIM JOON-DONG·Filed 2011·Application pending·0 cites
- 1649US2025349816A1Semiconductor package with carrier support structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1746US2011062599A1Integrated circuit packaging system with package stacking and method of manufacture thereofKIM JOON DONG·Filed 2009·Application pending·0 cites
- 1846US2025120268A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1943US8749300B2DC voltage conversion circuit of liquid crystal display apparatusKOREA ELECTRONICS TELECOMM·Filed 2012·Granted Jun 10, 2014·0 cites·6 claims
- 2038US11101394B2Method of transferring tin sulfide film and photoelectric device using the methodINU RES & BUSINESS FOUNDATION·Filed 2019·Granted Aug 24, 2021·0 cites·14 claims
- 2129US2018158971A1Transparent photoelectric element and method for fabricating the sameUNIV INCHEON IND ACAD COOP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →