Inventor · disambiguated record
Sem-Wei Lin
Also filed as: LIN SEM-WEI
2 granted patents·1 pending application·14 citations·filing 2006–2007
57Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0173US7250677B1Die package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 31, 2007·10 cites·19 claims
- 0265US7635917B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Dec 22, 2009·4 cites·13 claims
- 0336US2007029668A1Package module having a stacking platformADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →