Inventor · disambiguated record
Tim H. Lee
Also filed as: LEE TIM H
3 granted patents·29 citations·filing 2004–2021
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0189US11705396B2Method to form air gap structure with dual dielectric layerGLOBALFOUNDRIES US INC·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 0287US11127678B2Dual dielectric layer for closing seam in air gap structureGLOBALFOUNDRIES US INC·Filed 2019·Granted Sep 21, 2021·6 cites·15 claims
- 0372US6965171B1Method and structure for selective thermal paste deposition and retention on integrated circuit chip modulesIBM·Filed 2004·Granted Nov 15, 2005·21 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →