Inventor · disambiguated record
Takahisa Okuzono
Also filed as: OKUZONO TAKAHISA
4 granted patents·2 citations·filing 2017–2019
58Inventor score
Files withEBARA CORP4
Top patents by PatentIndex Score
4 records- 0173US11604150B2Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage mediumEBARA CORP·Filed 2019·Granted Mar 14, 2023·2 cites·25 claims
- 0272US11371155B2Method and apparatus for processing a substrateEBARA CORP·Filed 2019·Granted Jun 28, 2022·0 cites·4 claims
- 0364US10508352B2Method and apparatus for processing a substrateEBARA CORP·Filed 2017·Granted Dec 17, 2019·0 cites·7 claims
- 0449US10910334B2Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage mediumEBARA CORP·Filed 2019·Granted Feb 2, 2021·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →