Inventor · disambiguated record

Royce Yeoh Kao Tziat

Also filed as: TZIAT ROYCE YEOH KAO

2 granted patents·6 citations·filing 2007–2011

51Inventor score

Technology areasH10W

Files withSPANSION LLC1 TAN GIN GHEE1

Top patents by PatentIndex Score

2 records

0162US7932131B2Reduction of package height in a stacked die configurationSPANSION LLC·Filed 2007·Granted Apr 26, 2011·4 cites·17 claims
0257US8791007B2Device having multiple wire bonds for a bond area and methods thereofTAN GIN GHEE·Filed 2011·Granted Jul 29, 2014·2 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →