Inventor · disambiguated record
Frank J. Juskey
Also filed as: JUSKEY FRANK · JUSKEY FRANK J · JUSKEY FRANK JOSEPH · JUSKEY JR FRANK J
48 granted patents·2 pending applications·4,840 citations·filing 1989–2016
99Inventor score
Files withMOTOROLA INC32AMKOR TECHNOLOGY INC9JUSKEY FRANK J3TRIQUINT SEMICONDUCTOR INC3ADVANCED INTERCONNECT TECH LTD2
Top patents by PatentIndex Score
50 records- 0199US5371404AThermally conductive integrated circuit package with radio frequency shieldingMOTOROLA INC·Filed 1993·Granted Dec 6, 1994·462 cites·16 claims
- 0298US6340846B1Making semiconductor packages with stacked dies and reinforced wire bondsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 22, 2002·269 cites·21 claims
- 0398US5535101ALeadless integrated circuit packageMOTOROLA INC·Filed 1992·Granted Jul 9, 1996·351 cites·8 claims
- 0498US5336931AAnchoring method for flow formed integrated circuit coversMOTOROLA INC·Filed 1993·Granted Aug 9, 1994·353 cites·12 claims
- 0598US5264061AMethod of forming a three-dimensional printed circuit assemblyMOTOROLA INC·Filed 1992·Granted Nov 23, 1993·339 cites·14 claims
- 0697US6507102B2Printed circuit board with integral heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·142 cites·19 claims
- 0797US5438224AIntegrated circuit package having a face-to-face IC chip arrangementMOTOROLA INC·Filed 1993·Granted Aug 1, 1995·364 cites·3 claims
- 0897US4940181APad grid array for receiving a solder bumped chip carrierMOTOROLA INC·Filed 1989·Granted Jul 10, 1990·193 cites·19 claims
- 0995US5166772ATransfer molded semiconductor device package with integral shieldMOTOROLA INC·Filed 1991·Granted Nov 24, 1992·281 cites·10 claims
- 1095US5019673AFlip-chip package for integrated circuitsMOTOROLA INC·Filed 1990·Granted May 28, 1991·211 cites·2 claims
- 1194US6546620B1Flip chip integrated circuit and passive chip component package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·99 cites·20 claims
- 1294US6356453B1Electronic package having flip chip integrated circuit and passive chip componentAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·103 cites·15 claims
- 1394US5438216ALight erasable multichip moduleMOTOROLA INC·Filed 1992·Granted Aug 1, 1995·181 cites·23 claims
- 1493US6593545B1Laser defined pads for flip chip on leadframe package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 15, 2003·60 cites·19 claims
- 1592US5220489AMulticomponent integrated circuit packageMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·163 cites·15 claims
- 1691US9269887B1Ultrathin flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted Feb 23, 2016·17 cites·25 claims
- 1791US6577012B1Laser defined pads for flip chip on leadframe packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 10, 2003·67 cites·21 claims
- 1891US5218759AMethod of making a transfer molded semiconductor deviceMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·140 cites·19 claims
- 1990US8030770B1Substrateless packageTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted Oct 4, 2011·30 cites·13 claims
- 2090US5313365AEncapsulated electronic packageMOTOROLA INC·Filed 1992·Granted May 17, 1994·125 cites·4 claims
- 2189US8487435B2Sheet-molded chip-scale packageJUSKEY FRANK J·Filed 2011·Granted Jul 16, 2013·23 cites·18 claims
- 2286US5444303AWire bond pad arrangement having improved pad densityMOTOROLA INC·Filed 1994·Granted Aug 22, 1995·90 cites·9 claims
- 2385US6337228B1Low-cost printed circuit board with integral heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Jan 8, 2002·69 cites·19 claims
- 2482US5232758ANon-hardening solvent removable hydrophobic conformal coatingsMOTOROLA INC·Filed 1990·Granted Aug 3, 1993·44 cites·16 claims
- 2579US5296738AMoisture relief for chip carrierMOTOROLA INC·Filed 1992·Granted Mar 22, 1994·61 cites·12 claims
- 2679US5153385ATransfer molded semiconductor package with improved adhesionMOTOROLA INC·Filed 1991·Granted Oct 6, 1992·62 cites·15 claims
- 2778US6534338B1Method for molding semiconductor package having a ceramic substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 18, 2003·26 cites·32 claims
- 2877US9646857B2Low pressure encapsulant for size-reduced semiconductor packageQORVO US INC·Filed 2016·Granted May 9, 2017·3 cites·22 claims
- 2977US5542171AMethod of selectively releasing plastic molding material from a surfaceMOTOROLA INC·Filed 1991·Granted Aug 6, 1996·56 cites·7 claims
- 3077US5323947AMethod and apparatus for use in forming pre-positioned solder bumps on a pad arrangementMOTOROLA INC·Filed 1993·Granted Jun 28, 1994·58 cites·19 claims
- 3176US5065122ATransmission line using fluroplastic as a dielectricMOTOROLA INC·Filed 1990·Granted Nov 12, 1991·41 cites·13 claims
- 3275US5077633AGrounding an ultra high density pad array chip carrierMOTOROLA INC·Filed 1989·Granted Dec 31, 1991·42 cites·11 claims
- 3374US5463190AElectrically conductive adhesiveMOTOROLA INC·Filed 1994·Granted Oct 31, 1995·52 cites·21 claims
- 3473US5177669AMolded ring integrated circuit packageMOTOROLA INC·Filed 1992·Granted Jan 5, 1993·57 cites·18 claims
- 3572US8680683B1Wafer level package with embedded passive components and method of manufacturingJUSKEY FRANK J·Filed 2010·Granted Mar 25, 2014·4 cites·11 claims
- 3672US7247933B2Thin multiple semiconductor die packageADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Jul 24, 2007·16 cites·18 claims
- 3771US5800723AProcess for fabricating flex circuits and product therebyMOTOROLA INC·Filed 1996·Granted Sep 1, 1998·36 cites·25 claims
- 3865US7489021B2Lead frame with included passive devicesADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Feb 10, 2009·17 cites·35 claims
- 3963US6417576B1Method and apparatus for attaching multiple metal components to integrated circuit modulesAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 9, 2002·14 cites·20 claims
- 4062US5598967AMethod and structure for attaching a circuit module to a circuit boardMOTOROLA INC·Filed 1995·Granted Feb 4, 1997·21 cites·10 claims
- 4161US5132778ATransfer molding compoundMOTOROLA INC·Filed 1990·Granted Jul 21, 1992·28 cites·6 claims
- 4256US5679498AMethod for producing high density multi-layer integrated circuit carriersMOTOROLA INC·Filed 1995·Granted Oct 21, 1997·22 cites·12 claims
- 4354US5918363AMethod for marking functional integrated circuit chips with underfill materialMOTOROLA INC·Filed 1996·Granted Jul 6, 1999·20 cites·13 claims
- 4448US2014106511A1Flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2013·Application pending·0 cites
- 4543US2013234344A1Flip-chip packaging techniques and configurationsJUSKEY FRANK J·Filed 2012·Application pending·0 cites
- 4640US6137690AElectronic assemblyMOTOROLA INC·Filed 1997·Granted Oct 24, 2000·9 cites·23 claims
- 4740US6069679ASelective call receiver having a display module with integrated circuits and method thereforMOTOROLA INC·Filed 1997·Granted May 30, 2000·8 cites·19 claims
- 4838US5075820ACircuit components having different characteristics with constant sizeMOTOROLA INC·Filed 1990·Granted Dec 24, 1991·5 cites·26 claims
- 4934US5716760AMethod for plating a substrate to eliminate the use of a solder maskMOTOROLA INC·Filed 1997·Granted Feb 10, 1998·4 cites·30 claims
- 5032US5296046ASubliming solder flux compositionMOTOROLA INC·Filed 1993·Granted Mar 22, 1994·2 cites·14 claims
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