Inventor · disambiguated record
Seiji Fujino
Also filed as: FUJINO SEIJI
34 granted patents·1,050 citations·filing 1991–2016
97Inventor score
Top patents by PatentIndex Score
34 records- 0194US6151966ASemiconductor dynamical quantity sensor device having electrodes in Rahmen structureDENSO CORP·Filed 1999·Granted Nov 28, 2000·111 cites·23 claims
- 0294US5488243ASOI MOSFET with floating gateNIPPON DENSO CO·Filed 1993·Granted Jan 30, 1996·133 cites·10 claims
- 0393US6287885B1Method for manufacturing semiconductor dynamic quantity sensorDENSO CORP·Filed 1999·Granted Sep 11, 2001·84 cites·38 claims
- 0492US5525824ASemiconductor device with isolation regionsNIPPON DENSO CO·Filed 1994·Granted Jun 11, 1996·100 cites·16 claims
- 0589US9577216B2OLED display device, non-contact IC card and flexible display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Feb 21, 2017·11 cites·17 claims
- 0688US5421953AMethod and apparatus for direct bonding two bodiesNIPPON DENSO CO·Filed 1994·Granted Jun 6, 1995·121 cites·18 claims
- 0786US5869872ASemiconductor integrated circuit device and manufacturing method for the sameNIPPON DENSO CO·Filed 1997·Granted Feb 9, 1999·75 cites·12 claims
- 0882US5451547AMethod of manufacturing semiconductor substrateNIPPON DENSO CO·Filed 1992·Granted Sep 19, 1995·89 cites·9 claims
- 0978US9608230B2Organic electroluminescent device and manufacturing method thereof, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted Mar 28, 2017·2 cites·17 claims
- 1078US5874768ASemiconductor device having a high breakdown voltageNIPPON DENSO CO·Filed 1997·Granted Feb 23, 1999·43 cites·39 claims
- 1174US5383993AMethod of bonding semiconductor substratesNIPPON SOKEN·Filed 1993·Granted Jan 24, 1995·57 cites·21 claims
- 1272US9647236B2Packaging method of organic light emitting display panel, organic light emitting display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted May 9, 2017·2 cites·14 claims
- 1371US5313092ASemiconductor power device having walls of an inverted mesa shape to improve power handling capabilityNIPPON SOKEN·Filed 1992·Granted May 17, 1994·45 cites·19 claims
- 1469US5567968ASemiconductor device having SOI structure and method for fabricating the sameNIPPON DENSO CO·Filed 1995·Granted Oct 22, 1996·31 cites·23 claims
- 1568US5753556AMethod of fabricating a MIS transistorNIPPON DENSO CO·Filed 1996·Granted May 19, 1998·25 cites·17 claims
- 1667US10008691B2Array substrate and manufacturing method thereof, display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Jun 26, 2018·1 cites·12 claims
- 1767US5650354AMethod for producing semiconductor deviceNIPPON DENSO CO·Filed 1996·Granted Jul 22, 1997·31 cites·15 claims
- 1866US5466303ASemiconductor device and manufacturing method thereforNIPPON DENSO CO·Filed 1995·Granted Nov 14, 1995·31 cites·13 claims
- 1961US5223450AMethod of producing semiconductor substrate having dielectric separation regionNIPPON SOKEN·Filed 1991·Granted Jun 29, 1993·33 cites·20 claims
- 2060US9945025B2Evaporation coating apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Apr 17, 2018·0 cites·14 claims
- 2158US10177338B2Glass powder blend, glass powder paste and photoelectric packageBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Jan 8, 2019·0 cites·10 claims
- 2258US5164218ASemiconductor device and a method for producing the sameNIPPON SOKEN·Filed 1991·Granted Nov 17, 1992·25 cites·13 claims
- 2354US9789466B2Composition for packaging electronic device, packaging method, and OLED display apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Oct 17, 2017·0 cites·20 claims
- 2451US10067417B2Mask plate, mask exposure device and mask exposure methodBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·11 claims
- 2549US10487389B2Evaporation device and evaporation method using the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·20 claims
- 2649US9639319B2Display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted May 2, 2017·0 cites·16 claims
- 2747US10026635B2Packaging apparatus and packaging deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Jul 17, 2018·0 cites·16 claims
- 2846US9793361B2Thin film transistor, array substrate and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Oct 17, 2017·0 cites·15 claims
- 2945US10205119B2Laser packaging method and manufacturing method of display panelBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Feb 12, 2019·0 cites·8 claims
- 3044US9946151B2Method for producing a mask and the maskBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted Apr 17, 2018·0 cites·18 claims
- 3140US9865435B2Plasma generator, annealing device, deposition crystallization apparatus and annealing processBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted Jan 9, 2018·0 cites·18 claims
- 3239US10566392B2Encapsulation method, display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·20 claims
- 3336US10208375B2Evaporation source and evaporation deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Feb 19, 2019·0 cites·20 claims
- 3435US9929381B2Packaging equipment, method for using the same, and computer readable storage mediumBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →