Inventor · disambiguated record
Mitsuyuki Takada
Also filed as: TAKADA MITSUYUKI
21 granted patents·737 citations·filing 1984–1995
96Inventor score
Files withMITSUBISHI ELECTRIC CORP21
Top patents by PatentIndex Score
21 records- 0197US4993148AMethod of manufacturing a circuit boardMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Feb 19, 1991·148 cites·12 claims
- 0291US4914815AMethod for manufacturing hybrid integrated circuitsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Apr 10, 1990·101 cites·22 claims
- 0389US4942140AMethod of packaging semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 17, 1990·103 cites·24 claims
- 0485US5173844AIntegrated circuit device having a metal substrateMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 22, 1992·68 cites·4 claims
- 0580US5081562ACircuit board with high heat dissipations characteristicMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 14, 1992·53 cites·8 claims
- 0675US4685203AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Aug 11, 1987·22 cites·10 claims
- 0774US4629681AMethod of manufacturing multilayer circuit boardMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Dec 16, 1986·31 cites·7 claims
- 0873US4643798AComposite and circuit board having conductive layer on resin layer and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Feb 17, 1987·33 cites·14 claims
- 0966US5459594AApparatus for inspecting on-off states of a scattering-type liquid crystal display panelMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 17, 1995·29 cites·14 claims
- 1063US4785157AMethod for controlling electric resistance of a compound-type resistorsMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 15, 1988·12 cites·31 claims
- 1162US5059941AElectrode structure for a thick film resistorMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Oct 22, 1991·14 cites·2 claims
- 1260US4752555AMethod of manufacturing multilayer circuit boardMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Jun 21, 1988·25 cites·7 claims
- 1358US4783642AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 8, 1988·14 cites·7 claims
- 1453US5773879ACu/Mo/Cu clad mounting for high frequency devicesMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 30, 1998·27 cites·1 claims
- 1542US5672965AEvaluation board for evaluating electrical characteristics of an IC packageMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Sep 30, 1997·9 cites·12 claims
- 1642US4645734AComposite having conductive layer on resin layer and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Feb 24, 1987·9 cites·9 claims
- 1740US4963389AMethod for producing hybrid integrated circuit substrateMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 16, 1990·12 cites·5 claims
- 1840US4946709AMethod for fabricating hybrid integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Aug 7, 1990·9 cites·8 claims
- 1934US5175399AWiring panel including wiring having a surface-reforming layer and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 29, 1992·8 cites·16 claims
- 2033US4898805AMethod for fabricating hybrid integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Feb 6, 1990·6 cites·11 claims
- 2132US5069745AProcess for preparing a combined wiring substrateMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 3, 1991·4 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Mitsuyuki Takada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →