Inventor · disambiguated record
Jung Ho Shim
Also filed as: SHIM JUNG HO
15 granted patents·5 pending applications·62 citations·filing 2016–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0196US10325891B1Fan-out semiconductor package and package on package including the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 18, 2019·18 cites·20 claims
- 0294US9984979B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 29, 2018·10 cites·34 claims
- 0392US10256200B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 9, 2019·7 cites·20 claims
- 0492US10199337B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 5, 2019·9 cites·2 claims
- 0588US10262949B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 16, 2019·4 cites·40 claims
- 0688US10157851B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·5 cites·18 claims
- 0781US10685926B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 16, 2020·3 cites·20 claims
- 0875US10957670B2Package-on-package and package connection system comprising the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 23, 2021·2 cites·11 claims
- 0974US10672727B2Semiconductor package providing protection from electrical noiseSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·2 cites·13 claims
- 1073US10096552B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 9, 2018·2 cites·20 claims
- 1170US2024213509A1Solid oxide cell stackSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1264US11791298B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 1361US2025212326A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1461US2025275062A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1559US2025046725A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1654US11164838B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·17 claims
- 1751US11657968B2Multilayer capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted May 23, 2023·0 cites·24 claims
- 1851US10553541B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 1941US11069666B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 20, 2021·0 cites·17 claims
- 2038US2019164893A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →