Inventor · disambiguated record
Hideaki Miwa
Also filed as: MIWA HIDEAKI
2 granted patents·18 citations·filing 1992–2003
57Inventor score
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2 records- 0175US6905757B2Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminateMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 14, 2005·15 cites·9 claims
- 0236US5223641ACarboxylic acid mixtures and process for producing the sameIDEMITSU PETROCHEMICAL CHEMICA·Filed 1992·Granted Jun 29, 1993·3 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →