Inventor · disambiguated record
Stephen F. Moxham
Also filed as: MOXHAM STEPHEN · MOXHAM STEPHEN F
13 granted patents·2 pending applications·364 citations·filing 2000–2025
93Inventor score
Top patents by PatentIndex Score
15 records- 0194US6870276B1Apparatus for supporting microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 22, 2005·101 cites·61 claims
- 0292US7115982B2Semiconductor component having stiffener, stacked dice and circuit decalsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 3, 2006·21 cites·12 claims
- 0392US6577004B1Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·75 cites·46 claims
- 0490US6913952B2Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·76 cites·39 claims
- 0588US7268018B2Method for fabricating semiconductor component with stiffener and circuit decalMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 11, 2007·13 cites·32 claims
- 0687US6936916B2Microelectronic assemblies and electronic devices including connection structures with multiple elongated membersMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 30, 2005·39 cites·19 claims
- 0781US7061085B2Semiconductor component and system having stiffener and circuit decalMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·23 cites·32 claims
- 0880US2025374430A1Substrates with continuous slot viasMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0976US7335978B2Semiconductor component having stiffener, circuit decal and terminal contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 26, 2008·5 cites·16 claims
- 1067US12396097B2Substrates with continuous slot viasMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1166US6914326B2Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·11 cites·24 claims
- 1256US11942404B2Apparatuses and systems having ball grid arrays and associated microelectronic devices and device packagesMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 26, 2024·0 cites·21 claims
- 1346US2005242437A1Method and apparatus for supporting microelectronic substratesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 1440US6995026B2Methods for coupling a flowable conductive material to microelectronic substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 7, 2006·0 cites·37 claims
- 1539US7951646B2Solder ball landpad design to improve laminate performanceROUND ROCK RES LLC·Filed 2003·Granted May 31, 2011·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →