Inventor · disambiguated record
Kinya Fujino
Also filed as: FUJINO KINYA
1 granted patent·1 pending application·19 citations·filing 2003–2007
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0169US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0237US2009162467A1Resin Sealing/Molding ApparatusURAGAMI HIROSHI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →