Inventor · disambiguated record
Hiroshi Uragami
Also filed as: URAGAMI HIROSHI
3 granted patents·3 pending applications·22 citations·filing 2003–2015
64Inventor score
Top patents by PatentIndex Score
6 records- 0169US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0262US9728426B2Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2014·Granted Aug 8, 2017·2 cites·3 claims
- 0357US9580827B2Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2015·Granted Feb 28, 2017·1 cites·45 claims
- 0445US2011193261A1Compression molding method and compression molding apparatusTOWA CORP·Filed 2009·Application pending·0 cites
- 0537US2009162467A1Resin Sealing/Molding ApparatusURAGAMI HIROSHI·Filed 2007·Application pending·0 cites
- 0634US2015017372A1Method of manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic componentTOWA CORP·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →