Inventor · disambiguated record
Kai Etzel
Also filed as: ETZEL KAI
2 granted patents·3 pending applications·0 citations·filing 2015–2023
21Inventor score
Files withTRUMPF LASER & SYSTEMTECHNIK GMBH2TRUMPF WERKZEUGMASCHINEN GMBH CO KG2TRUMPF WERKZEUGMASCHINEN SE CO KG1
Top patents by PatentIndex Score
5 records- 0158US2023054278A1Method for determining a minimum width and an attachment position of a microjoint and method for machining a workpieceTRUMPF WERKZEUGMASCHINEN SE CO KG·Filed 2022·Application pending·0 cites
- 0252US2023311415A1Method and apparatus for producing three-dimensional objects by selectively solidifying a build material applied layer by layerTRUMPF LASER & SYSTEMTECHNIK GMBH·Filed 2023·Application pending·0 cites
- 0347US2023256675A1Method and apparatus for producing three-dimensional objects by selectively solidifying a build material applied layer by layerTRUMPF LASER & SYSTEMTECHNIK GMBH·Filed 2023·Application pending·0 cites
- 0441US9539633B2Machine tool drive systemTRUMPF WERKZEUGMASCHINEN GMBH CO KG·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
- 0535US10543522B2Processing unit and machine tool for the punching processing of workpiecesTRUMPF WERKZEUGMASCHINEN GMBH CO KG·Filed 2017·Granted Jan 28, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →