Inventor · disambiguated record
Sheldon C. Rieley
Also filed as: RIELEY SHELDON C · RIELEY SHELDON COLE
6 granted patents·156 citations·filing 1994–1996
86Inventor score
Technology areasH10W
Files withIBM6
Top patents by PatentIndex Score
6 records- 0173US5855993AElectronic devices having metallurgies containing copper-semiconductor compoundsIBM·Filed 1994·Granted Jan 5, 1999·49 cites·20 claims
- 0270US5608260ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1994·Granted Mar 4, 1997·38 cites·14 claims
- 0367US5545921APersonalized area leadframe coining or half etching for reduced mechanical stress at device edgeIBM·Filed 1994·Granted Aug 13, 1996·34 cites·7 claims
- 0449US5633047AElectronic devices having metallurgies containing copper-semiconductor compoundsIBM·Filed 1995·Granted May 27, 1997·15 cites·3 claims
- 0547US5576246APersonalized area leadframe coining or half etching for reduced mechanical stress at device edgeIBM·Filed 1995·Granted Nov 19, 1996·13 cites·8 claims
- 0638US5776801ALeadframe having contact pads defined by a polymer insulating filmIBM·Filed 1996·Granted Jul 7, 1998·7 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →