Inventor · disambiguated record
Cher Hau Danny Koh
Also filed as: DANNY KOH CHER HAU
5 granted patents·1 pending application·7 citations·filing 2017–2025
70Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0176US10741466B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·3 cites·7 claims
- 0275US11296000B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·1 cites·7 claims
- 0365US10325837B2Molded semiconductor package with C-wing and gull-wing leadsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 0464US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0559US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 0657US11217511B2Quad package with conductive clips connected to terminals at upper surface of semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·1 cites·27 claims
Join the waitlist — get patent alerts
Get an alert when Cher Hau Danny Koh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →