Inventor · disambiguated record
Praveen Nalla
Also filed as: NALLA PRAVEEN · NALLA PRAVEEN REDDY
14 granted patents·3 pending applications·83 citations·filing 2006–2018
89Inventor score
Top patents by PatentIndex Score
17 records- 0197US9837312B1Atomic layer etching for enhanced bottom-up feature fillLAM RES CORP·Filed 2016·Granted Dec 5, 2017·48 cites·20 claims
- 0293US10262943B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2018·Granted Apr 16, 2019·7 cites·19 claims
- 0393US9583386B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2015·Granted Feb 28, 2017·8 cites·21 claims
- 0493US9287183B1Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etchLAM RES CORP·Filed 2015·Granted Mar 15, 2016·11 cites·17 claims
- 0587US9768063B1Dual damascene fillLAM RES CORP·Filed 2016·Granted Sep 19, 2017·5 cites·20 claims
- 0681US9875968B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2017·Granted Jan 23, 2018·2 cites·19 claims
- 0769US7709400B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2007·Granted May 4, 2010·2 cites·25 claims
- 0857US9353444B2Two-step deposition with improved selectivityLAM RES CORP·Filed 2014·Granted May 31, 2016·0 cites·18 claims
- 0954US9551074B2Electroless plating solution with at least two borane containing reducing agentsLAM RES CORP·Filed 2014·Granted Jan 24, 2017·0 cites·14 claims
- 1052US9818617B2Method of electroless plating using a solution with at least two borane containing reducing agentsLAM RES CORP·Filed 2016·Granted Nov 14, 2017·0 cites·6 claims
- 1149US7884017B2Thermal methods for cleaning post-CMP wafersLAM RES CORP·Filed 2010·Granted Feb 8, 2011·0 cites·3 claims
- 1248US2016273113A1Two-step deposition with improved selectivityLAM RES CORP·Filed 2016·Application pending·0 cites
- 1346US9029258B2Through silicon via metallizationLAM RES CORP·Filed 2013·Granted May 12, 2015·0 cites·34 claims
- 1444US2009304914A1Self assembled monolayer for improving adhesion between copper and barrier layerLAM RES CORP·Filed 2006·Application pending·0 cites
- 1544US2008152823A1Self-limiting plating methodLAM RES CORP·Filed 2006·Application pending·0 cites
- 1642US10103056B2Methods for wet metal seed deposition for bottom up gapfill of featuresLAM RES CORP·Filed 2017·Granted Oct 16, 2018·0 cites·27 claims
- 1736US8946087B2Electroless copper depositionNALLA PRAVEEN REDDY·Filed 2012·Granted Feb 3, 2015·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →