Inventor · disambiguated record
Kenji Uhara
Also filed as: UHARA KENJI
8 granted patents·1 pending application·102 citations·filing 1998–2005
87Inventor score
Top patents by PatentIndex Score
9 records- 0179US6555238B2Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrateDUPONT TORAY CO LTD·Filed 2001·Granted Apr 29, 2003·18 cites·12 claims
- 0278US6916544B2Laminate type materials for flexible circuits or similar-type assemblies and methods relating theretoDUPONT TORAY CO LTD·Filed 2002·Granted Jul 12, 2005·16 cites·12 claims
- 0377US6908685B2Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrateDUPONT TORAY CO LTD·Filed 2001·Granted Jun 21, 2005·20 cites·8 claims
- 0476US6548179B2Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrateDUPONT TORAY CO LTD·Filed 2001·Granted Apr 15, 2003·16 cites·4 claims
- 0570US7273661B2Electrically conductive polyimide compositions having a carbon nanotube filler component and methods relating theretoDUPONT TORAY CO LTD·Filed 2003·Granted Sep 25, 2007·15 cites·9 claims
- 0655US6828390B2Polyimide substrates having an interpenetrating network morphology and methods relating theretoDU PONT·Filed 2002·Granted Dec 7, 2004·2 cites·12 claims
- 0751US7452610B2Multi-layer polyimide films and flexible circuit substrates therefromDU PONT TORAY CO LTD·Filed 2005·Granted Nov 18, 2008·0 cites·20 claims
- 0842US6277495B1Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plateDUPONT TORAY CO LTD·Filed 1998·Granted Aug 21, 2001·15 cites·14 claims
- 0941US2006009615A1Polyamic acids, polyimide films and polymide-metal laminates and methods for making sameUHARA KENJI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →