Inventor · disambiguated record
Guan Keng Quah
Also filed as: QUAH GUAN KENG
5 granted patents·1 pending application·85 citations·filing 2002–2006
81Inventor score
Files withSEMICONDUCTOR COMPONENTS IND6
Top patents by PatentIndex Score
6 records- 0183US6787392B2Structure and method of direct chip attachSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Sep 7, 2004·37 cites·7 claims
- 0273US7144538B2Method for making a direct chip attach device and structureSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 5, 2006·13 cites·17 claims
- 0373US6835580B1Direct chip attach structure and methodSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 28, 2004·28 cites·20 claims
- 0449US7098051B2Structure and method of direct chip attachSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Aug 29, 2006·4 cites·21 claims
- 0547US6852574B1Method of forming a leadframe for a semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Feb 8, 2005·3 cites·13 claims
- 0633US2008054420A1Semiconductor package structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →