Inventor · disambiguated record
Alan J. Emerick
Also filed as: EMERICK ALAN J · EMERICK ALAN JAMES
10 granted patents·1,185 citations·filing 1986–1999
93Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0198US6236115B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted May 22, 2001·342 cites·3 claims
- 0298US6187678B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted Feb 13, 2001·274 cites·16 claims
- 0398US6002177AHigh density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1995·Granted Dec 14, 1999·408 cites·20 claims
- 0480US5145104ASubstrate soldering in a reducing atmosphereIBM·Filed 1991·Granted Sep 8, 1992·75 cites·13 claims
- 0575US4919729ASolder paste for use in a reducing atmosphereIBM·Filed 1989·Granted Apr 24, 1990·28 cites·18 claims
- 0655US4799616ASolder leveling method and apparatusIBM·Filed 1987·Granted Jan 24, 1989·14 cites·13 claims
- 0753US4869418ASolder leveling method and apparatusIBM·Filed 1988·Granted Sep 26, 1989·13 cites·15 claims
- 0849US5567984AProcess for fabricating an electronic circuit packageIBM·Filed 1995·Granted Oct 22, 1996·15 cites·12 claims
- 0935US5050296AAffixing pluggable pins to a ceramic substrateIBM·Filed 1990·Granted Sep 24, 1991·10 cites·7 claims
- 1034US4676426ASolder leveling techniqueIBM·Filed 1986·Granted Jun 30, 1987·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →