Inventor · disambiguated record
Shelby Ferguson
Also filed as: FERGUSON SHELBY · FERGUSON SHELBY A · FERGUSON SHELBY ANN
6 granted patents·8 pending applications·27 citations·filing 2015–2025
78Inventor score
Top patents by PatentIndex Score
14 records- 0191US10455685B1Electronic device, socket, and spacer to alter socket profileINTEL CORP·Filed 2018·Granted Oct 22, 2019·12 cites·20 claims
- 0291US10260961B2Integrated circuit packages with temperature sensor tracesINTEL CORP·Filed 2015·Granted Apr 16, 2019·8 cites·25 claims
- 0384US10178763B2Warpage mitigation in printed circuit board assembliesINTEL CORP·Filed 2015·Granted Jan 8, 2019·5 cites·25 claims
- 0473US11291115B2Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array socketsINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·16 claims
- 0557US2025112392A1Semiconductor package carrier, and a corresponding system and method of useINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US2025223994A1Reinforced polymer nuts for socket loadingBUDDRIUS ERIC W·Filed 2025·Application pending·0 cites
- 0757US2024357744A1Integrated circuit packages including carriers with incorporated substrates and interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 0853US2023395460A1Backside integrated torsion loading mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 0952US2023019643A1Integrated separator devices for hardware component separationINTEL CORP·Filed 2022·Application pending·0 cites
- 1042US11296009B2Method and apparatus for detaching a microprocessor from a heat sinkINTEL CORP·Filed 2018·Granted Apr 5, 2022·0 cites·21 claims
- 1136US9991223B2Semiconductor package alignment frame for local reflowINTEL CORP·Filed 2015·Granted Jun 5, 2018·0 cites·14 claims
- 1236US2018174940A1Fine-featured traces for integrated circuit package support structuresINTEL CORP·Filed 2016·Application pending·0 cites
- 1332US2017178994A1Integrated circuit package support structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 1427US2017179066A1Bulk solder removal on processor packagingAOKI RUSSELL S·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shelby Ferguson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →