Inventor · disambiguated record
Ruisheng Wu
Also filed as: WU RUISHENG
6 granted patents·4 pending applications·26 citations·filing 2009–2019
77Inventor score
Files withHUANG PING4ALPHA & OMEGA SEMICONDUCTOR3Baidu online network technology beijing co ltd2FENG TAO1
Top patents by PatentIndex Score
10 records- 0186US7842543B2Wafer level chip scale package and method of laser marking the sameALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Nov 30, 2010·12 cites·6 claims
- 0283US8486803B2Wafer level packaging method of encapsulating the bottom and side of a semiconductor chipHUANG PING·Filed 2011·Granted Jul 16, 2013·8 cites·7 claims
- 0381US8987878B2Substrateless power device packagesFENG TAO·Filed 2010·Granted Mar 24, 2015·5 cites·7 claims
- 0465US9136154B2Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 15, 2015·1 cites·7 claims
- 0556US10839140B2Page displaying method, apparatus based on H5 webpage, and computer readable storage mediumBaidu online network technology beijing co ltd·Filed 2019·Granted Nov 17, 2020·0 cites·15 claims
- 0647US2015340301A1Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Application pending·0 cites
- 0743US2010327314A1Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production MethodHUANG PING·Filed 2009·Application pending·0 cites
- 0841US11360737B2Method and apparatus for providing speech serviceBaidu online network technology beijing co ltd·Filed 2018·Granted Jun 14, 2022·0 cites·15 claims
- 0934US2012142165A1Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSPHUANG PING·Filed 2011·Application pending·0 cites
- 1032US2011294262A1Semiconductor package process with improved die attach method for ultrathin chipsHUANG PING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →