Inventor · disambiguated record
Takamasa Hirayama
Also filed as: HIRAYAMA TAKAMASA
4 granted patents·15 pending applications·1 citations·filing 2007–2022
56Inventor score
Top patents by PatentIndex Score
19 records- 0156US8409884B2Process for producing organic electroluminescent panelHIRAYAMA TAKAMASA·Filed 2009·Granted Apr 2, 2013·1 cites·6 claims
- 0253US2022195256A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0353US2022119685A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0452US2010028669A1Re-releasable adhesive agent and re-releasable adhesive sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0549US2008038540A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0647US2025136849A1Adhesive sheet for temporarily fixing electronic componentNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0746US2024376351A1Pressure-sensitive adhesive sheet for temporarily fixing electronic component and method for treating electronic componentNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0845US12122947B2Adhesive sheetNITTO DENKO CORP·Filed 2019·Granted Oct 22, 2024·0 cites·15 claims
- 0945US2024343949A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1044US2011200744A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1142US12286569B2Adhesive sheetNITTO DENKO CORP·Filed 2019·Granted Apr 29, 2025·0 cites·13 claims
- 1239US2022372349A1Adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1339US2023026069A1Adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1438US2022059391A1Method for manufacturing electronic componentNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1537US2013260120A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1628US8524361B2Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheetSOEJIMA KAZUKI·Filed 2010·Granted Sep 3, 2013·0 cites·15 claims
- 1727US2014044957A1Production method for electronic component and pressure-sensitive adhesive sheet to be used in the production methodHIRAYAMA TAKAMASA·Filed 2012·Application pending·0 cites
- 1826US2013240141A1Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tapeSOEJIMA KAZUKI·Filed 2012·Application pending·0 cites
- 1922US2012237764A1Pressure-sensitive adhesive tape for temporary fixing of electronic partSOEJIMA KAZUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →