Inventor · disambiguated record
Renato Poinelli
Also filed as: POINELLI RENATO
7 granted patents·101 citations·filing 1991–2002
84Inventor score
Top patents by PatentIndex Score
7 records- 0168US6592352B1Offset edges mold for plastic packaging of integrated semiconductor devicesST MICROELECTRONICS SRL·Filed 2000·Granted Jul 15, 2003·18 cites·19 claims
- 0263US5793613AHeat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic deviceSGS THOMSON MICROELECTRONICS·Filed 1996·Granted Aug 11, 1998·34 cites·23 claims
- 0356US5163802AAutomatic handling of different magazines by standardized pick-ups and identification codesSGS THOMSON MICOELECTRONICS S·Filed 1991·Granted Nov 17, 1992·34 cites·5 claims
- 0451US7084003B2Method for manufacturing semiconductor device packagesST MICROELECTRONICS SRL·Filed 2002·Granted Aug 1, 2006·6 cites·10 claims
- 0536US5953593AMethod and mold for manufacturing a plastic package for an electronic device having a heat sinkST MICROELECTRONICS SRL·Filed 1997·Granted Sep 14, 1999·8 cites·23 claims
- 0627US5852324APlastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modesSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Dec 22, 1998·1 cites·15 claims
- 0727US5617295ALeadframe for supporting integrated semiconductor devicesST MICROELECTRONICS SRL·Filed 1995·Granted Apr 1, 1997·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Renato Poinelli files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →