Inventor · disambiguated record
Richard Te Gan
Also filed as: GAN RICHARD · GAN RICHARD TE
13 granted patents·4 pending applications·40 citations·filing 2008–2024
88Inventor score
Files withNXP USA INC10UNITED TEST & ASSEMBLY CT LT2UTAC HEADQUARTERS PTE LTD2NXP BV1UNITED TEST & ASSEMBLY CT LTD1
Top patents by PatentIndex Score
17 records- 0195US11404288B1Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 2, 2022·3 cites·20 claims
- 0293US11791283B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0390US8716873B2Semiconductor packages and methods of packaging semiconductor devicesWANG CHUEN KHIANG·Filed 2011·Granted May 6, 2014·19 cites·27 claims
- 0488US9136142B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Sep 15, 2015·7 cites·24 claims
- 0581US10192837B1Multi-via redistribution layer for integrated circuits having solder ballsNXP BV·Filed 2017·Granted Jan 29, 2019·4 cites·16 claims
- 0679US9589875B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Mar 7, 2017·2 cites·20 claims
- 0778US11222790B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2020·Granted Jan 11, 2022·1 cites·16 claims
- 0876US2025006511A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2024·Application pending·0 cites
- 0971US2023369248A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2023·Application pending·0 cites
- 1068US11967507B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 1165US12125716B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 22, 2024·0 cites·16 claims
- 1262US11728285B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1360US2025266610A1Electronic devices with sidewall antennas and methods of fabricating such devicesNXP USA INC·Filed 2024·Application pending·0 cites
- 1459US8030768B2Semiconductor package with under bump metallization aligned with open viasUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 1556US11705410B2Semiconductor device having integrated antenna and method thereforNXP USA INC·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 1656US9881863B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jan 30, 2018·0 cites·20 claims
- 1744US2010102436A1Shrink package on boardUNITED TEST & ASSEMBLY CT LTD·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →