Inventor · disambiguated record
Satish Yeldandi
Also filed as: YELDANDI SATISH
2 granted patents·1 pending application·3 citations·filing 2013–2017
42Inventor score
Top patents by PatentIndex Score
3 records- 0172US9704781B2Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 11, 2017·3 cites·22 claims
- 0248US9966347B2Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·0 cites·21 claims
- 0336US2019006459A1High-Dielectric Constant Capacitor Structures on III-V SubstratesAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →