Inventor · disambiguated record
Takaaki Shirasawa
Also filed as: SHIRASAWA TAKAAKI
15 granted patents·3 pending applications·104 citations·filing 2000–2020
89Inventor score
Top patents by PatentIndex Score
18 records- 0187US7772709B2Resin sealed semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Aug 10, 2010·17 cites·12 claims
- 0284US6642576B1Power semiconductor device having layered structure of power semiconductor elements and terminal membersMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Nov 4, 2003·51 cites·16 claims
- 0378US6819149B2Gate drive device for reducing a surge voltage and switching lossMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Nov 16, 2004·20 cites·7 claims
- 0463US10096566B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 9, 2018·1 cites·10 claims
- 0563US6291826B1Semiconductor element for electric power with a diode for sensing temperature and a diode for absorbing static electricityMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 18, 2001·14 cites·13 claims
- 0658US10049960B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 14, 2018·1 cites·17 claims
- 0754US10916483B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Feb 9, 2021·0 cites·1 claims
- 0853US10529682B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 7, 2020·0 cites·4 claims
- 0950US12046533B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 23, 2024·0 cites·19 claims
- 1047US2023187225A1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1146US10950558B2Semiconductor device, power converter, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 16, 2021·0 cites·15 claims
- 1245US11621213B2Semiconductor device including a spring plateMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 4, 2023·0 cites·21 claims
- 1345US10304748B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted May 28, 2019·0 cites·3 claims
- 1443US11302655B2Semiconductor device including a semiconductor element and a lead frame with a plurality of holesMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 12, 2022·0 cites·10 claims
- 1542US10224267B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Mar 5, 2019·0 cites·6 claims
- 1640US2015003016A1Semiconductor device and semiconductor systemMIYAMOTO NOBORU·Filed 2012·Application pending·0 cites
- 1739US2005199999A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1834US10714404B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 14, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →