Inventor · disambiguated record
Elmar Wisotzki
Also filed as: WISOTZKI ELMAR
12 granted patents·33 citations·filing 2012–2021
86Inventor score
Top patents by PatentIndex Score
12 records- 0191US9590033B1Trench separation diffusion for high voltage deviceIXYS CORP·Filed 2015·Granted Mar 7, 2017·16 cites·20 claims
- 0283US11037917B1Semiconductor device module and method of assemblyLITTELFUSE INC·Filed 2019·Granted Jun 15, 2021·3 cites·20 claims
- 0383US10193000B1Fast recovery inverse diodeIXYS LLC·Filed 2017·Granted Jan 29, 2019·3 cites·26 claims
- 0479US8716067B2Power device manufacture on the recessed side of a thinned waferWISOTZKI ELMAR·Filed 2012·Granted May 6, 2014·8 cites·23 claims
- 0570US9941256B1Inverse diode stackIXYS CORP·Filed 2016·Granted Apr 10, 2018·2 cites·15 claims
- 0666US9922864B2Trench separation diffusion for high voltage deviceIXYS CORP·Filed 2017·Granted Mar 20, 2018·1 cites·20 claims
- 0765US10847658B2Fast recovery inverse diodeIXYS LLC·Filed 2020·Granted Nov 24, 2020·0 cites·11 claims
- 0864US11545479B2Semiconductor device module and method of assemblyLITTELFUSE INC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 0962US10854581B2Die stack assembly using an edge separation structure for connectivity through a die of the stackLITTELFUSE INC·Filed 2020·Granted Dec 1, 2020·0 cites·11 claims
- 1059US10714635B2Fast recovery inverse diodeLITTELFUSE INC·Filed 2018·Granted Jul 14, 2020·0 cites·11 claims
- 1152US10734362B2Die stack assembly using an edge separation structure for connectivity through a die of the stackLITTELFUSE INC·Filed 2017·Granted Aug 4, 2020·0 cites·18 claims
- 1250US9704832B1Die stack assembly using an edge separation structure for connectivity through a die of the stackIXYS CORP·Filed 2016·Granted Jul 11, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →