Inventor · disambiguated record
Byong-Joo Kim
Also filed as: KIM BYONG-JOO
4 granted patents·1 pending application·9 citations·filing 2012–2018
66Inventor score
Top patents by PatentIndex Score
5 records- 0183US10147706B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·4 cites·20 claims
- 0278US9252123B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·5 cites·8 claims
- 0354US10679972B2Method of manufacturing multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·12 claims
- 0447US9384105B2Method of detecting faults of operation algorithms in a wire bonding machine and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 5, 2016·0 cites·20 claims
- 0539US2013093080A1Multi-chip package and method of manufacturing the sameHAN WON-GIL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →