Inventor · disambiguated record
Han-Ti Hsiaw
Also filed as: HSIAW HAN-TI
20 granted patents·2 pending applications·50 citations·filing 2003–2025
92Inventor score
Top patents by PatentIndex Score
22 records- 0195US9881834B1Contact openings and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 30, 2018·14 cites·20 claims
- 0294US10269569B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·9 cites·20 claims
- 0387US9728402B2Flowable films and methods of forming flowable filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·5 cites·20 claims
- 0486US9059259B2Hard mask for back-end-of-line (BEOL) interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·8 cites·18 claims
- 0583US10504734B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 0680US2025201564A1Method of manufacturing a semiconductor device with a work-function layer having a concentration of fluorineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0779US9960074B2Integrated bi-layer STI depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·2 cites·20 claims
- 0877US12272556B2Method of manufacturing a semiconductor device with a work-function layer having a concentration of fluorineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 0975US12125876B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 22, 2024·2 cites·16 claims
- 1075US9130022B2Method of back-end-of-line (BEOL) fabrication, and devices formed by the methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·5 cites·25 claims
- 1171US11380549B2Semiconductor device with a work function layer having a concentration of fluorineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 1270US12051614B2Isolation regions including two layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 1366US10727066B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 1464US10978341B2Contact openings and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1560US9048268B2Method and equipment for removing photoresist residue after dry etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·1 cites·18 claims
- 1659US10510593B2Contact openings and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 1757US11031280B2Isolation regions including two layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·20 claims
- 1854US9076845B2Method of forming a high density dielectric etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 7, 2015·0 cites·20 claims
- 1949US9379061B2High density dielectric etch-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 28, 2016·0 cites·20 claims
- 2044US6869836B1ILD stack with improved CMP resultsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 22, 2005·2 cites·23 claims
- 2143US9837267B2Optical filtering for integrated dielectrics UV curing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·0 cites·20 claims
- 2239US2015249024A1Method and equipment for removing photoresist residue afer dry etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →