Inventor · disambiguated record
Mario Antonio Aleo
Also filed as: ALEO MARIO ANTONIO
9 granted patents·1 pending application·0 citations·filing 2020–2023
75Inventor score
Top patents by PatentIndex Score
10 records- 0176US11948927B2Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the dieST MICROELECTRONICS SRL·Filed 2022·Granted Apr 2, 2024·0 cites·16 claims
- 0271US11569211B2Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the dieST MICROELECTRONICS SRL·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0367US11978411B2System architecture for high density mini/micro LED backlight applicationST MICROELECTRONICS SRL·Filed 2023·Granted May 7, 2024·0 cites·28 claims
- 0465US11710450B1Method for hybrid pulse amplitude and width modulation in LED drivers for display panelsST MICROELECTRONICS SRL·Filed 2022·Granted Jul 25, 2023·0 cites·16 claims
- 0565US11063027B2Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the dieST MICROELECTRONICS SRL·Filed 2020·Granted Jul 13, 2021·0 cites·20 claims
- 0661US11545082B1Method for hybrid pulse amplitude and width modulation in led drivers for display panelsST MICROELECTRONICS SRL·Filed 2022·Granted Jan 3, 2023·0 cites·18 claims
- 0759US11631376B1System architecture for high density mini/micro LED backlight applicationST MICROELECTRONICS SRL·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 0858US12293729B2Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2023·Granted May 6, 2025·0 cites·5 claims
- 0955US2023408867A1Optoelectronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1052US11831793B2Methods and devices for authenticationST MICROELECTRONICS DES & APPL·Filed 2020·Granted Nov 28, 2023·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →