Inventor · disambiguated record
Ken Yukawa
Also filed as: YUKAWA KEN
6 granted patents·2 pending applications·5 citations·filing 2010–2017
70Inventor score
Top patents by PatentIndex Score
8 records- 0172US10893603B2Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the sameTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2017·Granted Jan 12, 2021·2 cites·11 claims
- 0272US8756805B2Method of manufacturing multilayer printed wiring boardYAMAGUCHI NORIHIRO·Filed 2010·Granted Jun 24, 2014·3 cites·4 claims
- 0357US9420706B2Multilayer wiring boardTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2014·Granted Aug 16, 2016·0 cites·6 claims
- 0444US11236227B2Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing sameTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2016·Granted Feb 1, 2022·0 cites·11 claims
- 0541US2018222152A1Resin-clad copper foil, and printed wiring boardTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2016·Application pending·0 cites
- 0641US2019292381A1Conductive coating material and production method for shielded package using conductive coating materialTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2017·Application pending·0 cites
- 0740US11370926B2Conductive coating material and production method for shielded package using conductive coating materialTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2017·Granted Jun 28, 2022·0 cites·16 claims
- 0838US11414554B2Conductive coating material and production method for shielded package using conductive coating materialTATSUTA ELECTRIC WIRE & CABLE CO LTD·Filed 2017·Granted Aug 16, 2022·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →