Inventor · disambiguated record
Wolfgang Pahl
Also filed as: PAHL WOLFGANG
61 granted patents·5 pending applications·802 citations·filing 1987–2022
98Inventor score
Top patents by PatentIndex Score
66 records- 0196US8169041B2MEMS package and method for the production thereofPAHL WOLFGANG·Filed 2006·Granted May 1, 2012·41 cites·21 claims
- 0295US8432007B2MEMS package and method for the production thereofLEIDL ANTON·Filed 2011·Granted Apr 30, 2013·24 cites·18 claims
- 0394US6449828B2Method of producing a surface acoustic wave componentSIEMENS MATSUSHITA COMPONENTS·Filed 2001·Granted Sep 17, 2002·68 cites·2 claims
- 0493US8582788B2MEMS microphoneLEIDL ANTON·Filed 2006·Granted Nov 12, 2013·35 cites·23 claims
- 0592US10903156B2Electronic device with stud bumpsTDK CORP·Filed 2019·Granted Jan 26, 2021·6 cites·14 claims
- 0692US8294535B2Electrical component and production methodFEIERTAG GREGOR·Filed 2006·Granted Oct 23, 2012·28 cites·39 claims
- 0792US8184845B2Electrical module comprising a MEMS microphoneLEIDL ANTON·Filed 2006·Granted May 22, 2012·32 cites·16 claims
- 0892US6446316B1Method for producing an encapsulation for a SAW component operating with surface acoustic wavesSIEMENS MATSUSHITA COMPONENTS·Filed 1998·Granted Sep 10, 2002·102 cites·2 claims
- 0992US5831369AEncapsulation for electronic components and method for producing the encapsulationSIEMENS MATSUSHITA COMPONENTS·Filed 1996·Granted Nov 3, 1998·125 cites·12 claims
- 1090US9647196B2Wafer-level package and method for production thereofBAUER CHRISTIAN·Filed 2012·Granted May 9, 2017·14 cites·15 claims
- 1189US9056760B2Miniaturized electrical component comprising an MEMS and an ASIC and production methodFEIERTAG GREGOR·Filed 2011·Granted Jun 16, 2015·12 cites·10 claims
- 1289US8531018B2Component comprising a chip in a cavity and a stress-reduced attachmentPAHL WOLFGANG·Filed 2011·Granted Sep 10, 2013·11 cites·23 claims
- 1389US8229139B2MEMS microphone, production method and method for installingPAHL WOLFGANG·Filed 2006·Granted Jul 24, 2012·18 cites·12 claims
- 1488US9853204B2MEMS component and method for encapsulating MEMS componentsSNAPTRACK INC·Filed 2013·Granted Dec 26, 2017·8 cites·19 claims
- 1587US9061888B2Sensor module and method for producing sensor modulesPAHL WOLFGANG·Filed 2011·Granted Jun 23, 2015·6 cites·19 claims
- 1687US8571239B2MEMS microphoneFEIERTAG GREGOR·Filed 2011·Granted Oct 29, 2013·11 cites·20 claims
- 1786US8218794B2Component comprising a MEMS microphone and method for the production of said componentPAHL WOLFGANG·Filed 2009·Granted Jul 10, 2012·15 cites·13 claims
- 1883US9556022B2Method for applying a structured coating to a componentEPCOS AG·Filed 2014·Granted Jan 31, 2017·6 cites·20 claims
- 1982US8865499B2MEMS microphone and method for producing the MEMS microphonePAHL WOLFGANG·Filed 2011·Granted Oct 21, 2014·6 cites·20 claims
- 2077US10154582B2Method for producing a cased electrical componentSNAPTRACK INC·Filed 2017·Granted Dec 11, 2018·2 cites·4 claims
- 2177US9844128B2Cased electrical componentPAHL WOLFGANG·Filed 2011·Granted Dec 12, 2017·4 cites·6 claims
- 2277US7102224B2Encapsulated component and method for the production thereofEPCOS AG·Filed 2003·Granted Sep 5, 2006·21 cites·22 claims
- 2375US6528924B1Electronic component, in particular a component operating with surface acoustic wavesSIEMENS AG·Filed 1998·Granted Mar 4, 2003·47 cites·9 claims
- 2474US10542630B2Housing for an electric component, and method for producing a housing for an electric componentEPCOS AG·Filed 2015·Granted Jan 21, 2020·2 cites·16 claims
- 2574US9481565B2Encapsulated component comprising a MEMS component and method for the production thereofEPCOS AG·Filed 2013·Granted Nov 1, 2016·3 cites·18 claims
- 2674US6242842B1Electrical component, in particular saw component operating with surface acoustic waves, and a method for its productionSIEMENS MATSUSHITA COMPONENTS·Filed 1998·Granted Jun 5, 2001·23 cites·5 claims
- 2774US6136175AMethod of producing an electronic component, in particular a surface acoustic wave componentSIEMENS AG·Filed 1998·Granted Oct 24, 2000·27 cites·9 claims
- 2872US6310420B1Electronic component in particular an saw component operating with surface acoustic waves and a method for its productionSIEMENS AG·Filed 1998·Granted Oct 30, 2001·25 cites·5 claims
- 2971US8713789B2Method of manufacturing a microphoneLEIDL ANTON·Filed 2011·Granted May 6, 2014·3 cites·17 claims
- 3071US8611566B2MEMS-microphonePAHL WOLFGANG·Filed 2011·Granted Dec 17, 2013·3 cites·19 claims
- 3170US9278854B2Method for producing a sensorEPCOS AG·Filed 2013·Granted Mar 8, 2016·3 cites·18 claims
- 3269US10015600B2Multi-MEMS moduleEPCOS AG·Filed 2014·Granted Jul 3, 2018·2 cites·11 claims
- 3368US9035189B2Circuit board with flexible region and method for production thereofPAHL WOLFGANG·Filed 2009·Granted May 19, 2015·3 cites·22 claims
- 3468US7218189B2SAW component with adhesive location and use thereofEPCOS AG·Filed 2006·Granted May 15, 2007·5 cites·28 claims
- 3568US6057222AMethod for the production of flip-chip mounting-ready contacts of electrical componentsSIEMENS AG·Filed 1998·Granted May 2, 2000·34 cites·10 claims
- 3667US11444015B2Electronic device with stud bumpsTDK CORP·Filed 2020·Granted Sep 13, 2022·0 cites·16 claims
- 3765US11956579B2Lid, MEMS sensor component and methods of manufacturingTDK CORP·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 3865US8098001B2Component with reduced temperature response, and method for productionPAHL WOLFGANG·Filed 2010·Granted Jan 17, 2012·2 cites·28 claims
- 3965US6984421B2Encapsulation for an electrical component and method for producing the sameEPCOS AG·Filed 2001·Granted Jan 10, 2006·10 cites·16 claims
- 4064US10117027B2Microphone and method for producing a microphoneEPCOS AG·Filed 2015·Granted Oct 30, 2018·1 cites·15 claims
- 4161US9084366B2Electric component having a shallow physical shape, and method of manufacturePAHL WOLFGANG·Filed 2011·Granted Jul 14, 2015·1 cites·17 claims
- 4261US8674464B2MEMS component, method for producing a MEMS component, and method for handling a MEMS componentPAHL WOLFGANG·Filed 2010·Granted Mar 18, 2014·1 cites·35 claims
- 4359US6931699B2Method of producing a surface wave component with a drain for pyroelectric voltageEPCOS AG·Filed 2000·Granted Aug 23, 2005·7 cites·20 claims
- 4458US10136226B2Top-port MEMS microphone and method of manufacturing the sameEPCOS AG·Filed 2012·Granted Nov 20, 2018·1 cites·17 claims
- 4555US11492250B2Electronic device and method for manufacturing an electronic deviceTDK CORP·Filed 2020·Granted Nov 8, 2022·0 cites·18 claims
- 4653US10194227B2Top port microphone and method for the production of sameTDK CORP·Filed 2016·Granted Jan 29, 2019·0 cites·20 claims
- 4752US10164166B2MEMS component and method for encapsulating MEMS componentsSNAPTRACK INC·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 4852US2022127137A1Sensor Arrangement and Method for Producing a Sensor ArrangementTDK CORP·Filed 2021·Application pending·0 cites
- 4948US9331010B2System support for electronic components and method for production thereofPAHL WOLFGANG·Filed 2009·Granted May 3, 2016·0 cites·21 claims
- 5047US11234082B2Carrier substrate for stress sensitive device and method of manufactureTDK CORP·Filed 2018·Granted Jan 25, 2022·0 cites·14 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →