Inventor · disambiguated record
Wen-Long Lu
Also filed as: Lu wen-long
79 granted patents·15 pending applications·146 citations·filing 2011–2025
98Inventor score
Top patents by PatentIndex Score
94 records- 0198US9831195B1Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Nov 28, 2017·34 cites·20 claims
- 0297US11721652B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 8, 2023·3 cites·14 claims
- 0396US10388598B2Interposer, semiconductor package structure, and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 20, 2019·10 cites·19 claims
- 0495US11538760B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 27, 2022·3 cites·16 claims
- 0591US10103107B1Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 16, 2018·6 cites·19 claims
- 0691US9852971B1Interposer, semiconductor package structure, and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 26, 2017·5 cites·19 claims
- 0790US11699682B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 11, 2023·2 cites·17 claims
- 0890US10418314B2External connection pad for semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 17, 2019·7 cites·27 claims
- 0989US11362052B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 14, 2022·6 cites·14 claims
- 1089US10276480B1Semiconductor structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 30, 2019·6 cites·20 claims
- 1185US11694984B2Package structure including pillars and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 4, 2023·3 cites·14 claims
- 1285US10224301B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·4 cites·18 claims
- 1384US10515889B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 24, 2019·4 cites·23 claims
- 1482US10529664B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 1581US12142584B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Nov 12, 2024·0 cites·14 claims
- 1681US10497657B1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 3, 2019·3 cites·20 claims
- 1781US10418316B1Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 17, 2019·3 cites·23 claims
- 1881US2025070058A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1980US10566279B2Package device, semiconductor device, and method for manufacturing the package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 18, 2020·4 cites·20 claims
- 2079US11302644B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 12, 2022·2 cites·20 claims
- 2179US10658306B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 19, 2020·2 cites·19 claims
- 2277US12224219B2Package structure and circuit layer structure including dummy trace and manufacturing method thereforADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 2377US11856856B2Thermal conduction unit, electronic module and heat dissipating deviceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 26, 2023·2 cites·14 claims
- 2477US10818586B1Substrate structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 27, 2020·2 cites·15 claims
- 2577US10438885B1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 8, 2019·2 cites·20 claims
- 2676US11215762B2Optical device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 4, 2022·2 cites·19 claims
- 2776US10903151B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 26, 2021·2 cites·31 claims
- 2876US10854527B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 1, 2020·2 cites·13 claims
- 2976US10700029B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 30, 2020·2 cites·16 claims
- 3076US10510705B2Semiconductor package structure having a second encapsulant extending in a cavity defined by a first encapsulantADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 17, 2019·2 cites·15 claims
- 3176US10269672B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·2 cites·32 claims
- 3275US12046523B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 23, 2024·1 cites·20 claims
- 3375US11024569B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 1, 2021·2 cites·10 claims
- 3475US10714403B2Semiconductor device package with patterned conductive layers and an interconnecting structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 14, 2020·2 cites·20 claims
- 3575US10446325B2Capacitor structuresADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 15, 2019·2 cites·19 claims
- 3675US10420211B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 17, 2019·2 cites·21 claims
- 3775US2025183106A1Package structure and circuit layer structure including dummy trace and manufacturing method thereforADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 3874US10217712B2Semiconductor package and semiconductor process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 26, 2019·2 cites·21 claims
- 3971US11239174B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 1, 2022·1 cites·15 claims
- 4071US10629558B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Apr 21, 2020·1 cites·18 claims
- 4170US11721645B2Semiconductor package device and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 4270US11430708B2Package structure and circuit layer structure including dummy trace and manufacturing method thereforADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 4370US11139247B2Interconnection structure, semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·1 cites·17 claims
- 4469US10658280B2Electrical device including a through-silicon via structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 19, 2020·1 cites·21 claims
- 4569US10424539B2Wiring structure, semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 24, 2019·2 cites·19 claims
- 4667US9853011B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 26, 2017·1 cites·20 claims
- 4766US2023027674A1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4863US2022128768A1Optical device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4960US11056446B2Semiconductor package device and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 6, 2021·0 cites·22 claims
- 5058US11495557B2Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →