Inventor · disambiguated record
Norio Moriike
Also filed as: MORIIKE NORIO
8 granted patents·4 pending applications·28 citations·filing 2002–2009
83Inventor score
Top patents by PatentIndex Score
12 records- 0180US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0279US7964289B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jun 21, 2011·5 cites·21 claims
- 0370US7615277B2Formation method of metal layer on resin layer, printed wiring board, and production method thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 10, 2009·10 cites·18 claims
- 0462US7629045B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 8, 2009·2 cites·19 claims
- 0562US2008138505A1Formation method of metal layer on resin layer, printed wiring board, and production method thereofTAKAI KENJI·Filed 2008·Application pending·0 cites
- 0654US8815334B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardTAKAI KENJI·Filed 2009·Granted Aug 26, 2014·0 cites·7 claims
- 0754US7818877B2Formation method of metal layer on resin layerHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 26, 2010·0 cites·12 claims
- 0853US7862889B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 4, 2011·0 cites·18 claims
- 0950US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 1049US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 1149US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 1236US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Norio Moriike files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →