Inventor · disambiguated record
Wolfgang Hetzel
Also filed as: HETZEL WOLFGANG · HETZEL WOLFGANG JOHANNES
12 granted patents·5 pending applications·191 citations·filing 1998–2020
91Inventor score
Top patents by PatentIndex Score
17 records- 0189US6894381B2Electronic device having a stack of semiconductor chips and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 17, 2005·68 cites·18 claims
- 0288US7402911B2Multi-chip device and method for producing a multi-chip deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 22, 2008·19 cites·13 claims
- 0383US7265441B2Stackable single package and stacked multi-chip assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 4, 2007·13 cites·20 claims
- 0481US6927484B2Stack arrangement of a memory moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 9, 2005·31 cites·33 claims
- 0580US11469161B2Lead frame-based semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·1 cites·23 claims
- 0671US8624372B2Semiconductor component comprising an interposer substrateHETZEL WOLFGANG·Filed 2006·Granted Jan 7, 2014·6 cites·19 claims
- 0766US6977427B2Electronic component having stacked semiconductor chips in parallel, and a method for producing the componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 20, 2005·14 cites·10 claims
- 0861US7198979B2Method for manufacturing a stack arrangement of a memory moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 3, 2007·10 cites·27 claims
- 0952US7851899B2Multi-chip ball grid array package and method of manufactureUTAC UNITED TEST AND ASSEMBLY TEST CT LTD·Filed 2004·Granted Dec 14, 2010·10 cites·14 claims
- 1046US8072085B2Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the sameHETZEL WOLFGANG·Filed 2004·Granted Dec 6, 2011·3 cites·16 claims
- 1146US2011162204A1Integrated deviceQIMONDA AG·Filed 2011·Application pending·0 cites
- 1246US2008064232A1Integrated deviceQIMONDA AG·Filed 2007·Application pending·0 cites
- 1342US6075358ADevice in a semiconductor manufacturing installation in particular for integrated circuitsSIEMENS AG·Filed 1998·Granted Jun 13, 2000·16 cites·11 claims
- 1441US2008203581A1Integrated circuitQIMONDA AG·Filed 2007·Application pending·0 cites
- 1538US2007090527A1Integrated chip device in a packageTHOMAS JOCHEN·Filed 2005·Application pending·0 cites
- 1637US8592258B2Semiconductor package and method of attaching semiconductor dies to substratesCASTILLO DENVER PAUL C·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 1737US2009194871A1Semiconductor package and method of attaching semiconductor dies to substratesUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wolfgang Hetzel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →