Inventor · disambiguated record
Seishi Oida
Also filed as: OIDA SEISHI
7 granted patents·2 pending applications·117 citations·filing 1998–2011
84Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD3MATSUSHITA ELECTRONICS CORP2CHI DAHE1OIDA SEISHI1OOMORI KOUJI1
Top patents by PatentIndex Score
9 records- 0180US6291274B1Resin molded semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Sep 18, 2001·60 cites·8 claims
- 0278US6258314B1Method for manufacturing resin-molded semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 2000·Granted Jul 10, 2001·25 cites·17 claims
- 0357US6126885AMethod for manufacturing resin-molded semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Oct 3, 2000·20 cites·2 claims
- 0452US9018761B2Semiconductor deviceOOMORI KOUJI·Filed 2008·Granted Apr 28, 2015·1 cites·18 claims
- 0550US6853077B2Semiconductor device, semiconductor packaging method, assembly and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 8, 2005·8 cites·22 claims
- 0649US6917118B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 12, 2005·3 cites·8 claims
- 0736US2012001275A1Semiconductor deviceCHI DAHE·Filed 2011·Application pending·0 cites
- 0835US2001045640A1Resin-molded semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 0928US8283759B2Lead frame having outer leads coated with a four layer platingOIDA SEISHI·Filed 2006·Granted Oct 9, 2012·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →