Inventor · disambiguated record
Paul Dijkstra
Also filed as: DIJKSTRA PAUL
14 granted patents·3 pending applications·110 citations·filing 2003–2019
90Inventor score
Files withNXP BV5KONINKLIJKE PHILIPS NV3DIJKSTRA PAUL2GROENHUIS ROELF ANCO JACOB1INTERHEALTH NUTRACEUTICALS INC1
Top patents by PatentIndex Score
17 records- 0192US8183682B2Methods of packaging a semiconductor die and package formed by the methodsDIJKSTRA PAUL·Filed 2006·Granted May 22, 2012·36 cites·25 claims
- 0283US7247938B2Carrier, method of manufacturing a carrier and an electronic deviceNXP BV·Filed 2003·Granted Jul 24, 2007·35 cites·10 claims
- 0382US10501342B2UV-C water purification deviceSIGNIFY HOLDING BV·Filed 2016·Granted Dec 10, 2019·6 cites·7 claims
- 0482US9066926B2Method of reducing exercise-induced joint pain in non-arthritic mammalsINTERHEALTH NUTRACEUTICALS INC·Filed 2014·Granted Jun 30, 2015·11 cites·16 claims
- 0576US7944062B2Air cavity package for a semiconductor die and methods of forming the air cavity packageNXP BV·Filed 2006·Granted May 17, 2011·7 cites·25 claims
- 0668US8159826B2Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatmentsDIJKSTRA PAUL·Filed 2006·Granted Apr 17, 2012·6 cites·16 claims
- 0765US9863585B2Light source assembly and method for producing the samePHILIPS LIGHTING HOLDING BV·Filed 2015·Granted Jan 9, 2018·1 cites·15 claims
- 0858US8153480B2Air cavity package for flip-chipSTEENBRUGGEN GEERT·Filed 2006·Granted Apr 10, 2012·5 cites·14 claims
- 0956US9691959B2Light emitting device packageKONINKLIJKE PHILIPS NV·Filed 2015·Granted Jun 27, 2017·1 cites·4 claims
- 1051US7858444B2Electronic device and method of manufacturing thereofNXP BV·Filed 2009·Granted Dec 28, 2010·0 cites·10 claims
- 1146US7514801B2Electronic device and method of manufacturing thereofNXP BV·Filed 2004·Granted Apr 7, 2009·2 cites·12 claims
- 1242US10475973B2Light emitting device packageKONINKLIJKE PHILIPS NV·Filed 2017·Granted Nov 12, 2019·0 cites·6 claims
- 1339US7989934B2Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrierNXP BV·Filed 2008·Granted Aug 2, 2011·0 cites·16 claims
- 1439US2021386376A1Electric component of an interventional medical deviceKONINKLIJKE PHILIPS NV·Filed 2019·Application pending·0 cites
- 1532US2012112351A1Semiconductor device packaging method and semiconductor device packageWALCZYK SVEN·Filed 2011·Application pending·0 cites
- 1630US2012286410A1Semiconductor device packaging method and semiconductor device packageGROENHUIS ROELF ANCO JACOB·Filed 2011·Application pending·0 cites
- 1728US8070971B2Etch methodKLOOSTERMAN JAN·Filed 2005·Granted Dec 6, 2011·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →