Inventor · disambiguated record
Sheng-Tsung Hsiao
Also filed as: HSIAO SHENG-TSUNG
7 granted patents·3 pending applications·42 citations·filing 2014–2024
81Inventor score
Top patents by PatentIndex Score
10 records- 0198US11996351B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·20 cites·20 claims
- 0298US11387164B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·19 cites·20 claims
- 0396US11410910B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0484US12341081B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0580US11901263B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 0677US2024249999A1Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0776US11631629B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 0861US11955405B2Semiconductor package including thermal interface structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0953US2023420337A1Cooling Cover and Packaged Semiconductor Device Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1049US2015166881A1Packaging material and led packaging structure containing the sameLEXTAR ELECTRONICS CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →