Inventor · disambiguated record
Daniel A. Steckert
Also filed as: STECKERT DANIEL · STECKERT DANIEL A
6 granted patents·1 pending application·141 citations·filing 1997–2011
84Inventor score
Technology areasH10P
Top patents by PatentIndex Score
7 records- 0179US7344975B2Method to reduce charge buildup during high aspect ratio contact etchMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 18, 2008·5 cites·41 claims
- 0277US6107172AControlled linewidth reduction during gate pattern formation using an SiON BARCADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 22, 2000·54 cites·19 claims
- 0373US8673787B2Method to reduce charge buildup during high aspect ratio contact etchSANDHU GURTEJ S·Filed 2011·Granted Mar 18, 2014·2 cites·18 claims
- 0473US5965461AControlled linewidth reduction during gate pattern formation using a spin-on barcADVANCED MICRO DEVICES INC·Filed 1997·Granted Oct 12, 1999·45 cites·20 claims
- 0569US7985692B2Method to reduce charge buildup during high aspect ratio contact etchMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 26, 2011·2 cites·24 claims
- 0668US5879975AHeat treating nitrogen implanted gate electrode layer for improved gate electrode etch profileADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 9, 1999·33 cites·14 claims
- 0736US2006043536A1Implanted photoresist to reduce etch erosion during the formation of a semiconductor deviceCO CHIH-CHEN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →