Inventor · disambiguated record
Wooram Myung
Also filed as: MYUNG WOORAM
5 granted patents·2 pending applications·0 citations·filing 2019–2025
59Inventor score
Top patents by PatentIndex Score
7 records- 0174US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0263US12005520B2Laser bonding apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0362US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 0448US12288745B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 0547US12463122B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0646US2023132054A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0737US11229124B2Method for forming redistribution layer using photo-sinteringRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2019·Granted Jan 18, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →