Inventor · disambiguated record
Jinho An
Also filed as: AN JINHO
6 granted patents·3 pending applications·19 citations·filing 2015–2024
76Inventor score
Top patents by PatentIndex Score
9 records- 0191US9799619B2Electronic device having a redistribution areaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 24, 2017·9 cites·20 claims
- 0289US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0388US9806004B2Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping padSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 31, 2017·8 cites·19 claims
- 0473US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0573US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0671US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0763US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 0857US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 0955US2024266319A1Method of Multi-layer Die Stacking with Die-to-Wafer BondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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