Inventor · disambiguated record
Baeyong Kim
Also filed as: KIM BAEYONG
3 granted patents·2 pending applications·7 citations·filing 2007–2014
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0168US8633586B2Mock bump system for flip chip integrated circuitsKIM OH HAN·Filed 2008·Granted Jan 21, 2014·5 cites·20 claims
- 0252US8709934B2Electronic system with vertical intermetallic compoundKIM BAEYONG·Filed 2007·Granted Apr 29, 2014·2 cites·9 claims
- 0347US2014159236A1Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP CoatingSTATS CHIPPAC LTD·Filed 2014·Application pending·0 cites
- 0446US2009233436A1Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP CoatingSTATS CHIPPAC LTD·Filed 2008·Application pending·0 cites
- 0536US8624402B2Mock bump system for flip chip integrated circuitsKIM YOUNGMIN·Filed 2008·Granted Jan 7, 2014·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →