Inventor · disambiguated record
Masahiko Miyauchi
Also filed as: MIYAUCHI MASAHIKO
10 granted patents·3 pending applications·35 citations·filing 2004–2021
81Inventor score
Top patents by PatentIndex Score
13 records- 0176US6921971B2Heat releasing member, package for accommodating semiconductor element and semiconductor deviceKYOCERA CORP·Filed 2004·Granted Jul 26, 2005·31 cites·17 claims
- 0271US8846552B2Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistanceMIYAUCHI MASAHIKO·Filed 2009·Granted Sep 30, 2014·2 cites·19 claims
- 0369US10815390B2Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereofKANEKA CORP·Filed 2018·Granted Oct 27, 2020·0 cites·10 claims
- 0464US10017666B2Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereofKANEKA CORP·Filed 2014·Granted Jul 10, 2018·0 cites·13 claims
- 0561US12410280B2Synthesis, purification, and properties of ring-opened benzoxazine thermoplasticKANEKA CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0658US7745914B2Package for receiving electronic parts, and electronic device and mounting structure thereofKYOCERA CORP·Filed 2006·Granted Jun 29, 2010·2 cites·10 claims
- 0757US10526450B2Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using theseKANEKA CORP·Filed 2018·Granted Jan 7, 2020·0 cites·14 claims
- 0852US2023174718A1Thermoplastic-thermoset hybrid resins, methods, and uses thereofKANEKA CORP·Filed 2021·Application pending·0 cites
- 0951US12077644B2Amide acid oligomer process for molding polyimide compositesKANEKA AMERICAS HOLDING INC·Filed 2019·Granted Sep 3, 2024·0 cites·15 claims
- 1050US2010086813A1Reaction Apparatus, Fuel Cell System and Electronic DeviceKYOCERA CORP·Filed 2007·Application pending·0 cites
- 1141US10047246B2Varnish including 2-phenyl-4,4′-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strengthKANEKA CORP·Filed 2015·Granted Aug 14, 2018·0 cites·16 claims
- 1241US9051430B2Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistanceMIYAUCHI MASAHIKO·Filed 2012·Granted Jun 9, 2015·0 cites·4 claims
- 1337US2012295504A1Carbon fiber reinforced composite materialsMIYAUCHI MASAHIKO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →