Inventor · disambiguated record
Seungwon Lim
Also filed as: LIM SEUNGWON
1 granted patent·2 pending applications·9 citations·filing 2005–2010
35Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0179US8890310B2Power module package having excellent heat sink emission capability and method for manufacturing the sameLEE KEUNHYUK·Filed 2010·Granted Nov 18, 2014·9 cites·9 claims
- 0249US2010013070A1Power module package having excellent heat sink emission capability and method for manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Application pending·0 cites
- 0341US2006056213A1Power module package having excellent heat sink emission capability and method for manufacturing the sameLEE JOOSANG·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Seungwon Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →