Inventor · disambiguated record
Ki Bon Cha
Also filed as: CHA KI BON
5 granted patents·1 pending application·83 citations·filing 1997–2012
82Inventor score
Top patents by PatentIndex Score
6 records- 0194US8823158B2Semiconductor package and stacked semiconductor package having the sameSK HYNIX INC·Filed 2012·Granted Sep 2, 2014·27 cites·6 claims
- 0281US8299591B2Semiconductor package and stacked semiconductor package having the sameOH JAE SUNG·Filed 2008·Granted Oct 30, 2012·10 cites·4 claims
- 0370US6924556B2Stack package and manufacturing method thereofUNISEMICON CO LTD·Filed 2002·Granted Aug 2, 2005·24 cites·22 claims
- 0463US7291906B2Stack package and fabricating method thereofCHA KI BON·Filed 2003·Granted Nov 6, 2007·16 cites·13 claims
- 0535US2008203552A1Stacked Package and Method of Fabricating the SameUNISEMICON CO LTD·Filed 2005·Application pending·0 cites
- 0634US5977643AChip-size semiconductor packageLG SEMICON CO LTD·Filed 1997·Granted Nov 2, 1999·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →