Inventor · disambiguated record
Kum Leong
Also filed as: LEONG KUM FOO
4 granted patents·1 pending application·20 citations·filing 2002–2007
69Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0161US6828512B2Apparatus and methods for interconnecting components to via-in-pad interconnectsINTEL CORP·Filed 2002·Granted Dec 7, 2004·14 cites·8 claims
- 0252US7701069B2Solder interface locking using unidirectional growth of an intermetallic compoundINTEL CORP·Filed 2003·Granted Apr 20, 2010·6 cites·25 claims
- 0348US7692301B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2007·Granted Apr 6, 2010·0 cites·7 claims
- 0438US7229913B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2003·Granted Jun 12, 2007·0 cites·20 claims
- 0535US2005067699A1Diffusion barrier layer for lead free package substrateINTEL CORP·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kum Leong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →