Inventor · disambiguated record
Masaaki Kurita
Also filed as: KURITA MASAAKI
9 granted patents·2 pending applications·36 citations·filing 2002–2019
81Inventor score
Files withHITACHI LTD3TANAKA PRECIOUS METAL IND3OGASHIWA TOSHINORI2BROTHER IND LTD1NATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE & TECHNOLOGY1
Top patents by PatentIndex Score
11 records- 0176US6936847B2Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation filmHITACHI LTD·Filed 2003·Granted Aug 30, 2005·18 cites·15 claims
- 0275US10451779B2Polygon mirror, method for manufacturing polygon mirror, and reflecting mirrorBROTHER IND LTD·Filed 2017·Granted Oct 22, 2019·2 cites·15 claims
- 0374US6624443B2Display device with an improved contact hole arrangement for contacting a semiconductor layer through an insulation filmHITACHI LTD·Filed 2002·Granted Sep 23, 2003·16 cites·6 claims
- 0447US7388228B2Display device and method of manufacturing the sameHITACHI LTD·Filed 2005·Granted Jun 17, 2008·0 cites·13 claims
- 0546US11262345B2Method for measuring glycated protein using interdigitated electrodeULTIZYME INT LTD·Filed 2016·Granted Mar 1, 2022·0 cites·15 claims
- 0646US2015369770A1Biosensor and method for manufacturing sameTANAKA PRECIOUS METAL IND·Filed 2014·Application pending·0 cites
- 0744US2015362501A1Biosensor and process for producing sameTANAKA PRECIOUS METAL IND·Filed 2014·Application pending·0 cites
- 0839US9065418B2Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same materialOGASHIWA TOSHINORI·Filed 2010·Granted Jun 23, 2015·0 cites·18 claims
- 0938US10256113B2Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrateTANAKA PRECIOUS METAL IND·Filed 2012·Granted Apr 9, 2019·0 cites·9 claims
- 1037US12194744B2Liquid jet discharge deviceNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE & TECHNOLOGY·Filed 2019·Granted Jan 14, 2025·0 cites·7 claims
- 1136US8912088B2Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrateOGASHIWA TOSHINORI·Filed 2011·Granted Dec 16, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →