Inventor · disambiguated record
Koichiro Nishizawa
Also filed as: NISHIZAWA KOICHIRO
16 granted patents·4 pending applications·10 citations·filing 2002–2022
87Inventor score
Top patents by PatentIndex Score
20 records- 0177US9576845B2Method for manufacturing a semiconductor device including a hollow structure around an electrode of a semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 21, 2017·3 cites·11 claims
- 0274US10854523B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 1, 2020·2 cites·16 claims
- 0371US10304730B2Semiconductor device having a Pd-containing adhesion layerMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 28, 2019·1 cites·4 claims
- 0470US8728939B2Method for manufacturing semiconductor device and semiconductor manufacturing systemMAEDA KAZUHIRO·Filed 2013·Granted May 20, 2014·2 cites·20 claims
- 0562US9887131B2Semiconductor device having a Pd-containing adhesion layerMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 6, 2018·1 cites·7 claims
- 0658US8158507B2Method for manufacturing semiconductor deviceNISHIZAWA KOICHIRO·Filed 2010·Granted Apr 17, 2012·1 cites·8 claims
- 0753US2024312915A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0849US12033905B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 9, 2024·0 cites·21 claims
- 0947US2014035145A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Application pending·0 cites
- 1044US11244874B2Substrate bonding structure and substrate bonding methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 1144US10020246B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 10, 2018·0 cites·3 claims
- 1244US2023326758A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1343US9048295B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jun 2, 2015·0 cites·12 claims
- 1442US9922836B2Semiconductor device manufacturing method and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Mar 20, 2018·0 cites·10 claims
- 1540US9887284B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 6, 2018·0 cites·12 claims
- 1640US8581411B2Semiconductor deviceNISHIZAWA KOICHIRO·Filed 2010·Granted Nov 12, 2013·0 cites·12 claims
- 1739US10950567B2Hollow sealed device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 16, 2021·0 cites·8 claims
- 1836US10224294B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Mar 5, 2019·0 cites·19 claims
- 1935US8766445B2Semiconductor deviceHISAKA TAKAYUKI·Filed 2012·Granted Jul 1, 2014·0 cites·5 claims
- 2035US2004016940A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →