Inventor · disambiguated record
Jing Hui Li
Also filed as: LI JING · LI JING HUI
6 granted patents·1 pending application·38 citations·filing 2007–2022
79Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD3LI JING1LI JING HUI1SAMSUNG ELECTRONICS CO LTD1YANGTZE MEMORY TECH CO LTD1
Top patents by PatentIndex Score
7 records- 0192US8358007B2Integrated circuit system employing low-k dielectrics and method of manufacture thereofGLOBALFOUNDRIES SG PTE LTD·Filed 2010·Granted Jan 22, 2013·18 cites·19 claims
- 0290US8619540B2Apparatus and method for transmitting and receiving uplink sounding signal in broadband wireless communication systemLI JING·Filed 2010·Granted Dec 31, 2013·12 cites·36 claims
- 0367US7687381B2Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewallSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 30, 2010·4 cites·18 claims
- 0465US8053361B2Interconnects with improved TDDBGLOBALFOUNDRIES SG PTE LTD·Filed 2008·Granted Nov 8, 2011·3 cites·13 claims
- 0554US9281278B2Interconnects with improved TDDBLI JING HUI·Filed 2011·Granted Mar 8, 2016·1 cites·8 claims
- 0654US2024164117A1Semiconductor devices and fabrication methods thereof, memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 0744US7906426B2Method of controlled low-k via etch for Cu interconnectionsGLOBALFOUNDRIES SG PTE LTD·Filed 2007·Granted Mar 15, 2011·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →